Planarizaiton of Cu Interconnect using ECMP Process
نویسندگان
چکیده
منابع مشابه
Micromachined High-Q Inductors in 0.18μm Cu Interconnect Low-K CMOS Process
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ژورنال
عنوان ژورنال: Journal of the Korean Institute of Electrical and Electronic Material Engineers
سال: 2007
ISSN: 1226-7945
DOI: 10.4313/jkem.2007.20.3.213